Équipement scientifique

5 -07 88 HIGH LOAD, DUAL HEAD PACKAGE INCLUDES: - HIGH LOAD I/O HARDWARE BOARD - DUAL HEAD MOUNTING BRACKET - NO CHARGE OPTION WITH PURCHASE 0F A HIGH LOAD TRANSDUCER FOR A PERFORMECH CONFIGURED SYSTEM 3. NANODMA II OPTION 5-0190-TI-UPG NANODMA II TM UPGRADE - DYNAMIC CONTACT STIFFNESS AND DAI4PING FOR MODULUS MEASUREMENT 0F VISCOELASTIC MATERIALS, METALS, AND CERAMI CS - MEASURE AI4PLITUDE AND PHASE, CONTACT STIFFNESS, AND DAMPING COEFFICIENT - CALCULATE STORAGE/LOSS MODULUS AND TAN - NANODMA II SOFTWARE MODULE - FREQUENCY SWEEP AND RAMPED LOAD TESTING - AUTOMATIC DYNAMIC SYSTEM CALIBRATION - NANODMA II TRANSDUCER FOR ENHANCED DYNAI4IC PERFORMANCE - LOCK-IN-AMPLIFIER AND GPIB BOARD NOT INCLUDED - INCLUDES GRANITE UPGRADE 4. MODULUS MAPPING OPTION 5-0246-TI MODULUS MAPPING *REQUIRES NANODMA II - QUANTITATIVE HIGH-RESOLUTION MECHANICAL PROPERTY MAPPING OVER AN AREA ON A SAMPLE SURFACE FROM A SINGLE SPM SCAN - MAPPING 0F VISCOELASTIC RESPONSE INCLUDING LOSS STIFFNESS, STORAGE STIFFNESS, AND DAI4PING (TAN) - “ROAD MAP” TO FURTHER INVESTIGATE MECHANICAL PROPERTIES 0F MICROSTRUCTURES - COMPLETE CALIBRATION ROUTINES FOR THE SYSTEM - AUTOMATIC CALCULATION 0F LOSS, STORAGE AND COMPLEX MODULUS FROM STIFFNESS DATA - FULL COLOR, ADJUSTABLE SPATIAL PLOTS 0F MECHANICAL PROPERTIES - LINE BY LINE CROSS-SECTION ANALYSIS AND HISTOGRAMS - POINT-AND-CLICK MOVEMENT TO SPECIFIC POSITIONS ON MAPS TO FURTHER INVESTIGATE USING QUASISTATIC TESTS - STIFFNESS CONTRAST CAN 3E CORRELATED WITH CRACKS, DE-BONDING AND BUCKLING ON THIN FILM SYSTEMS 5. TOP DOWN, CLOSED LOOP SCANNER OPTION 5 -07 95 TOP DOWN, CLOSED LOOP SCANNER - IN-SITU SPM IMAGING CAPABILITY EXCLUSIVE TO HYSITRONS’ S INSTRUMENTATION - REAL-TIME POSITIONAL FEEDBACK ELIMINATES TESTING DIFFICULTIES ARISING FROM PIEZO CREEP AND HYSTERESIS - INCREASED SCAN RANGE (X-Y: bOUM, Z: 1SUM) - CAPACITIVE POSITION SENSORS WITH SUB-NANOMETER NOISE PERFORMANCE AND A SCANNING LINEARITY OF>99.95% - ADVANCED DSP CONTROL ALGORITHMS TO MAINTAIN ACCURACY AND SPEED - ULTRA-FAST SETTLE TIME ALLOWS FOR INCREASED SAI4PLE T HROUGH P UT - COMPATIBLE WITH HYSITRON CAPACITANCE TRANSDUCERS - INCOMPATIBLE WITH “DUAL HEAD” SETUP. THE SCANNER SIZE IS SUCH THAT THE HIGH LOAD TRANSDUCER WILL NEED TO 3E REMOVED AND STORED.

6. NANOECRTM APPLICATION PACKAGE

5-0617-220 ONE-DIMENSIONAL TRANSDUCER PACKAGE FOR NANOECRTM CONDUCT IVE APPLI CATION - UP TO 10MN NORMAL FORCE - PATENTED 3-PLATE CAPACITIVE FORCE TRANSDUCER - MEASUREMENT 0F NORMAL FORCE AND DISPLACEMENT FOR NANOINDENTATION TESTING - ELECTROSTATIC FORCE ACTUATION/CAPACITIVE DISPLACEMENT SENSOR - RIGID DOVETAIL MOUNTING ASSEMBLY - DRIVE CIRCUIT BOARD - CAPACITIVE DISPLACEMENT DETECTION CARD - TRANSDUCER INCORPORATES THE INTERNAL CONNECTION - HIGHLY DOPED CONDUCTIVE DIAMOND TIP - INCLUSIVE EQUIPMENT, PICOAMMETER, CONDUCTIVE SAMPLE STAGE, SIGNAL BREAK OUT BOX, - INCLUDES FEEDBACK CONTROL, TRIBOANALYSIS AND ORIGIN PRO V8.0 SOFTWARE - CUSTOMER NEEDS TO ACQUIRE CONDUCTIVE ADHESIVE FOR SAMPLE MOUNTING. 7. 5 -05 13 ELECTRICALLY SHIELDED ENVIRONMENTAL ISOLATION ENCLOSURE ENGINEERED MOLDED FIBERGLASS COVER ACOUSTIC ISOLATION THERMAL ISOLATION AIR CURRENT ISOLATION INTERNAL LED LIGHTING 8. ON-SITE INSTALLATION AND TRAINING 6-0008 ON-SITE INSTALLATION & BASIC TRAINING - OPTION INSTALLATIONS - DURATION: 3 DAYS - HARDWARE & SOFTWARE TRAINING - REASONABLE TRAVEL EXPENSES INCLUDED 9. TIP AND CALIBRATION STANDARD TI-0037 CUBE CORNER, 90 DEG TOTAL INCLUDED ANGLE 3-SIDED PYRAMIDAL DIAI4OND PROBE TIP 10. 5-0098 FUSED QUARTZ STANDARD STANDARD SAMPLE 11. COLLABORATION DISCOUNT / IN KIND CONTRIBUTION* *HYSITRON IN KIND CONTRIBUTION AND MATCHING GRANT FOR PARTICIPATION IN THE CFI PROGRAI4. ECOLE POLYTECHNIQUE AGREES TO CO-AUTHOR PAPERS OR WRITE APPLICATION NOTES SUITABLE FOR HYSITRON MARKETING PURPOSES.

12. ONE TIME DEMO DISCOUNT ON CLOSED LOOP

SCANNER** **DEMONSTRATOR UNIT IS IN “AS NEW” CONDITION.

DISCOUNT IS CONTINGENT ON THE AVAILABILITY

0F A DEMONSTRATION UNIT.